Category Archives: Components

More cheap Processor yay.

Samsung has taped out 14nm ARM CPU with finfet. Hey Samsung, so are we going to get it by 2014?

The Cortex-A7 processor test chip was implemented by Cadence in collaboration with ARM and Samsung. Cadence delivered a full RTL-to-signoff flow, building upon a tool set that has been thoroughly tested on 20nm designs requiring automated double patterning. The tight collaboration with Samsung and ARM enabled Cadence to hone its technology for 14nm FinFET designs, paving the way for 14nm market readiness. ARM used Cadence tools to develop the 14nm FinFET libraries, and Cadence tools were also used for a full-flow RTL-to-signoff tapeout of the processor core on Samsung’s 14nm FinFET process, as well as chip-level integration and verification. samsungtomorrow, androidheadlines

TSMC is building Giant fab in the US.

Taiwan Semiconductor Manufacturing Co. CEO Morris Chang confirms that his company is contemplating another U.S. factory, but says the hunt has no connection to Apple.

“The U.S. is one of the places under consideration,” Chang said at the annual Supply Chain Management Forum in Taiwan, according to Taipei Times. “But this has nothing to do with Apple.” oregonlive

Samsung to Proceed With $4 Billion Austin Plant Expansion

the world’s second-largest semiconductor maker, said it will go ahead with a $4 billion expansion of its U.S. chip plants in Austin, Texas, betting on surging demand for smartphone processors. bloomberg


By 2014 or so, the entire planet will be flooded with advanced chip for sure. More chip please. I want my toys.


Anticipated Screen Technology for 2013

1. Bendable plastic substrate screen

Samsung-Display flexible-high res AMOLED. New 5.5G lines adopt flexible and LITI technologies from the A2P3 line. Liti make high resolution AMOLED possible and flexible Amoled are also possible with that line. The thin-film process is close to resolving technological difficulties that have prevented flexible displays and delayed 5.5G OLED capex. This lines could be ready for mass produce in 2Q 2013 and 4Q 2013. oled-display

2. Ultra high resolution

According to DigiTimes, the Taiwanese company Innolux will begin mass producing their own 5 inch 1080p panels in Q1 2013. They’re going to use something called AAS (Azimuthal Anchoring Switch) technology. androidauthority

AUO introduce high resolution AMOLED with 317ppi. oled-display

3. Igzo

Sharp began making smartphone displays using a semiconductor technology known as IGZO this month at its plant in Tenri, central Japan, Heihachiro Ochiai, a Sharp spokesman, said by phone today. Sharp is also in talks with Dell Inc. (DELL) and Hewlett-Packard Co. (HPQ) to supply IGZO displays, the Yomiuri newspaper said Oct. 20. bloomberg

[in April] Sharp today said it was making available 32in, 3840 x 2160 panels – that’s 140 dots per inch – for monitors, plus 10in, 2560 x 1600 (300dpi) and 7in, 1280 x 800 (217dpi) for tablets. reghardware

4. In cell touch screen

In-cell touch, DITO tech gaining ground for mobile device displays

With the advent of two new touch sensor technologies, more than 7.5% of the mobile phone market will use “in-cell touch” in 2012 and tablet PCs will see a 5% shipment share of “DITO film structure” technology, reports NPD DisplaySearch. In-cell touch’s market share is estimated to grow to 16.7% by 2018. electroiq

Next-Generation Tegra Ready for CES

Nvidia next Tegra has taped out, ready for CES 2013 and probably will be in product by February.

““We think we will announce our [next-generation Tegra] products at CES and our customers will announced their products at MWC,” said Chris Evenden, director of investor relations of Nvidia at Raymond James IT supply chain conference.

Nvidia Tegra “Grey” system-on-chip features built-in 3G and 4G/LTE communication technologies, the developer pins a lot of hopes on it as it should help it to penetrate the market of mass smartphones (that can be sold at a discount price), which will boost its market share considerably. Tegra “Wayne” is the next-generation multi-core application processor, which is presumably based on ARM Cortex-A15 general-purpose cores as well as a new GeForce-class graphics engine.” xbitlabs



22nm Finfet Overrated. Intel Needs A Hit.

Intel can’t seem to catch a break. Finfet supposed to be Intel ace to beat ARM low power and break smartphone/tablet market. But it seems Finfet won’t come into play until beyond 20nm. Intel really need a winning chip out soon, not 2015 or beyond. Otherwise they won’t never be able to break critical mass against ARM overwhelming marketshare. Both Samsung and TSMC are accelerating their 28nm ramp up and 20nm start. Intel is going to be in serious pain if 64bit arms gain market traction. Intel will be a goner within 2 years.

28nm FD-SOI Beats 22nm Finfet For Low Power.

FD-SOI with metal gate last will be the winning process technology at 28nm and 20nm, with finfets proving to be a second-rate solution, says Professor Asen Asenov, professor of Electrical Engineering at Glasgow University who is founder and CEO of the leading statistical variablity company Gold Standard Simulations.
“Putting FD-SOI with metal gate last will be an absolutely stunning technology,” says Asenov, “this technology will be the absolute winner and it also solves the problems at 20nm. If the companies which use it play their cards well, they will have a competitive advantage.”

This means finfets will not be needed for a generation or two, while the only company using finfets – Intel – has not seen it deliver any significant advantage in terms of low power.

“In terms of low power, Intel’s 22nm finfet process has no big advantage compared to Intel’s 32nm bulk process,” says Asenov. electronicsweekly

“The real numbers are not very impressive, IBM got much better numbers and Intel’s own 45- and 65-nm numbers were better,” he claimed.

Sahidi blamed parasitics that resulted from Intel’s decision to dope the FinFET structures. “If they go down this path to 14 and 10 nm of doping, it gets worse–you have to be un-doped,” Sahidi said. eetimes